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| 1.6x0.8mm SMD CHIP LED LAMP AP1608SYCK SUPER BRIGHT YELLOW Features !1.6mmx0.8mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE Description The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: CDA0222 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: OCT/23/2001 DRAWN: Y.M. LIU PAGE: 1 OF4 Selection Guide Iv (m c d ) @ 20 m A Min . AP1608SYCK SUPER BRIGHT YELLOW ( InGaAlP) WATER CLEAR 30 Ty p . 60 V i ew i n g An g l e 21/2 120 Par t No . Dic e L en s Ty p e Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Halfwidth Capacitance Forward Voltage Reverse Current D ev i c e Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Ty p . 590 590 20 20 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s IF=20mA IF=20mA IF=20mA VF=0V;f=1MHz IF=20mA V R = 5V Absolute Maximum Ratings at T)=25C P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating Temperature Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Su p er B r ig h t Yello w 125 30 175 5 -40C To +85C -40C To +85C Un it s mW mA mA V SPEC NO: CDA0222 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: OCT/23/2001 DRAWN: Y.M. LIU PAGE: 2 OF4 Super Bright Yellow AP1608SYCK SPEC NO: CDA0222 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: OCT/23/2001 DRAWN: Y.M. LIU PAGE: 3 OF4 AP1608SYCK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: CDA0222 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: OCT/23/2001 DRAWN: Y.M. LIU PAGE: 4 OF4 |
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